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Packaging Differences and Advantages of SMD and COB

In the production of led, there are different packaging technologies, including cob led and SMD led. What is the difference between cob led and SMD led?

The production process of COB packaging is basically the same as that of traditional SMD. The system thermal resistance of traditional SMD packaging application is: chip-solder joint-solder paste-copper foil-insulating layer-aluminum material. The thermal resistance of COB packaging system is: chip - gel - aluminium material. Traditional SMD packaging labor and manufacturing costs account for about 15% of the material cost, COB packaging labor and manufacturing costs account for about 10% of the material cost.

The efficiency of COB packaging is much higher than that of SMD products. With COB packaging, labor and manufacturing costs can be saved by 5%. The thermal resistance of COB package system is much lower than that of traditional SMD package system, which greatly improves the life of LED. Traditional SMD packages use patches to attach discrete devices to PCB boards to form light source components for LED applications. This method has the problems of spot lighting, glare and ghosting. The COB package is an integrated package and a surface light source. It has a large angle of view and can be easily adjusted to reduce the loss of light refraction.

Advantages of COB packaging over traditional SMD packaging

Through the above introduction, we can clearly find the difference between cob led and SMD led. With the continuous progress of LED lighting technology, more and more attention has been paid to COB technology. COB light source is widely used in indoor and outdoor lighting, such as tube lamp, bulb lamp, fluorescent tube, street lamp and industrial and mining lamp, because of its low thermal resistance, high light flux density, less glare and uniform luminescence.

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