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What Is A Flip Cop COB (Flip COB) Light Source?

Flip COB LED is already a common product category in lighting products. There are many brands that produce cob light source, but many people still don't understand the meaning of flip chip COB LED.

COB is the abbreviation of Chip on Board in English, which means chip on board packaging technology, which can be simply understood as: a luminescent body integrated with multiple LED chips on the same substrate.

COB integrated packaging is a relatively mature LED packaging method. With the wide application of LED products in the field of lighting, flip COB LED has become one of the mainstream products in the packaging industry.

The flip COB LED is a high light efficiency integrated surface of light source technology in which the LED chip is directly attached to a high-reflection mirror metal substrate. This technology eliminates the bracket concept, no electroplating, no reflow soldering, and no patching process, so nearly one third of the process is reduced. What’s more, the cost is also saved by one third.

The flip chip COB LED can be simply understood as a high-power integrated surface light source, and the light-emitting area and external dimensions of the light source can be designed according to the product outline structure.

The main products of bare chip technology mainly have two forms: one is COB technology, and the other is flip cob technology. Chip On Board (COB), the semiconductor chip is placed on the printed circuit board, and the electrical connection between the chip and the substrate is realized by a wire stitching method and covered with a resin to ensure reliability.

The main application of flip COB LED:

The main application indoors are: spotlights, downlights, ceiling lights, ceiling lamps, fluorescent lamps and light strips.
Outdoor application such as street lights, high bay lights, floodlights and wall lights at night in the city, luminous characters, etc.

Flip COB manufacturing process:

The Chip On Board (COB) LED package process first covers the wafer placement point with a thermally conductive epoxy resin (usually an epoxy resin doped with silver particles) on the surface of the substrate, and then places the silicon wafer directly on the surface of the substrate. The heat treatment is performed until the silicon wafer is firmly fixed to the substrate, and then the electrical connection is directly established between the silicon wafer and the substrate by wire bonding.
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